1. product profile 1.1 general description two planar schottky barrier double diodes with common cathodes and an integrated guard ring for stress protection encapsulat ed in a sot666 ultra small and flat lead surface-mounted device (smd) plastic package. 1.2 features and benefits ? low forward voltage ? low capacitance ? aec-q101 qualified ? ultra small and flat lead smd plastic package ? excellent coplanarity and improved thermal behavior 1.3 applications ? ultra high-speed switching ? voltage clamping ? line termination ? reverse polarity protection 1.4 quick reference data [1] pulse test: t p 300 s; ? 0.02. BAT54CV two schottky barrier double diodes rev. 3 ? 15 november 2010 product data sheet table 1. quick reference data symbol parameter conditions min typ max unit per diode i f forward current - - 200 ma v r reverse voltage - - 30 v v f forward voltage [1] i f =0.1ma - - 240 mv i f =1ma - - 320 mv i f =10ma - - 400 mv i f =30ma - - 500 mv i f = 100 ma - - 800 mv
BAT54CV all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 15 november 2010 2 of 10 nxp semiconductors BAT54CV two schottky barrier double diodes 2. pinning information 3. ordering information 4. marking 5. limiting values table 2. pinning pin description simplified outline graphic symbol 1 anode (diode 1) 2 anode (diode 2) 3 common cathode (diode 3, 4) 4 anode (diode 3) 5 anode (diode 4) 6 common cathode (diode 1, 2) 123 4 5 6 1 5 6 23 4 sym05 7 table 3. ordering information type number package name description version BAT54CV - plastic surface-mounted package; 6 leads sot666 table 4. marking codes type number marking code BAT54CV c5 table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit per diode v r reverse voltage - 30 v i f forward current - 200 ma i frm repetitive peak forward current t p 10 ms; ? 0.5 - 0.85 a i fsm non-repetitive peak forward current square wave; t p =8.3ms [1] -2a
BAT54CV all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 15 november 2010 3 of 10 nxp semiconductors BAT54CV two schottky barrier double diodes [1] t j =25 c prior to surge. [2] reflow soldering is the only recommended soldering method. [3] device mounted on an fr4 printed-circuit board ( pcb), single-sided copper, tin-plated and standard footprint. [4] device mounted on an fr4 pcb, single-sided c opper, tin-plated, mounting pad for cathode 1 cm 2 . 6. thermal characteristics [1] for schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses p r are a significant part of the total power losses. [2] reflow soldering is the only recommended soldering method. [3] device mounted on an fr4 pcb, single-si ded copper, tin-plated and standard footprint. [4] device mounted on an fr4 pcb, single-sided c opper, tin-plated, mounting pad for cathode 1 cm 2 . [5] soldering point of cathode tab. per device, one diode loaded p tot total power dissipation t amb 25 c [2] [3] -350mw [4] -420mw t j junction temperature - 125 c t amb ambient temperature ? 65 +125 c t stg storage temperature ? 65 +150 c table 5. limiting values ?continued in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit table 6. thermal characteristics symbol parameter conditions min typ max unit per device, one diode loaded r th(j-a) thermal resistance from junction to ambient in free air [1] [2] [3] --360k/w [4] --300k/w r th(j-sp) thermal resistance from junction to solder point [5] --175k/w
BAT54CV all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 15 november 2010 4 of 10 nxp semiconductors BAT54CV two schottky barrier double diodes 7. characteristics [1] pulse test: t p 300 s; ? 0.02. table 7. characteristics t amb =25 c unless otherwise specified. symbol parameter conditions min typ max unit per diode v f forward voltage [1] i f =0.1ma - - 240 mv i f =1ma - - 320 mv i f =10ma - - 400 mv i f =30ma - - 500 mv i f = 100 ma - - 800 mv i r reverse current v r =25v - - 2 a c d diode capacitance v r =1v; f=1mhz - - 10 pf (1) t amb = 125 c (2) t amb =85 c (3) t amb =25 c (1) t amb = 125 c (2) t amb =85 c (3) t amb =25 c fig 1. forward current as a function of forward voltage; typical values fig 2. reverse current as a function of reverse voltage; typical values 10 3 10 2 10 ? 1 i f (ma) v f (v) 10 1 1.2 0.8 0.4 0 msa892 (3) (2) (1) (3) (2) (1) 0102030 v r (v) 10 3 10 2 10 ? 1 i r ( a) 10 1 (1) (2) (3) msa893
BAT54CV all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 15 november 2010 5 of 10 nxp semiconductors BAT54CV two schottky barrier double diodes 8. test information 8.1 quality information this product has been qualified in accordance with the automotive electronics council (aec) standard q101 - stress test qualificat ion for discrete semiconductors , and is suitable for use in automotive applications. 9. package outline t amb =25 c; f = 1 mhz fig 3. diode capacitance as a function of reverse voltage; typical values 0102030 0 5 10 15 v r (v) c d (pf) msa891 fig 4. package outline BAT54CV (sot666) dimensions in mm 04-11-08 1.7 1.5 1.7 1.5 1.3 1.1 1 0.18 0.08 0.27 0.17 0.5 pin 1 index 123 4 5 6 0.6 0.5 0.3 0.1
BAT54CV all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 15 november 2010 6 of 10 nxp semiconductors BAT54CV two schottky barrier double diodes 10. packing information [1] for further information and the avai lability of packing methods, see section 14 . 11. soldering table 8. packing methods the indicated -xxx are the last thre e digits of the 12nc ordering code. [1] type number package description packing quantity 4000 BAT54CV sot666 4 mm pitch, 8 mm tape and reel -115 reflow soldering is the only recommended soldering method. fig 5. reflow soldering footprint BAT54CV (sot666) solder lands placement area occupied area solder paste sot666_ fr 2.75 2.45 2.1 1.6 0.4 (6 ) 0.55 (2 ) 0.25 (2 ) 0.6 (2 ) 0.65 (2 ) 0.3 (2 ) 0.325 (4 ) 0.45 (4 ) 0.5 (4 ) 0.375 (4 ) 1.7 2 1.7 1.075 0.538 dimensions in mm
BAT54CV all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 15 november 2010 7 of 10 nxp semiconductors BAT54CV two schottky barrier double diodes 12. revision history table 9. revision history document id release date data sheet status change notice supersedes BAT54CV v.3 20101115 product data sheet - BAT54CV_2 modifications: ? section 1.2 ? features and benefits ? : amended. ? table 1 ? quick reference data ? : updated. ? table 5 ? limiting values ? : p tot amended. ? table 6 ? thermal characteristics ? : r th(j-a) amended, r th(j-sp) added. ? figure 4 : superseded by minimized outline drawing. ? section 8 ? test information ? : added. ? section 11 ? soldering ? : added. ? section 13 ? legal information ? : updated. BAT54CV_2 20100115 objective data sheet - BAT54CV_1 BAT54CV_1 20040922 objective data sheet - -
BAT54CV all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 15 november 2010 8 of 10 nxp semiconductors BAT54CV two schottky barrier double diodes 13. legal information 13.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 13.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 13.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
BAT54CV all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 15 november 2010 9 of 10 nxp semiconductors BAT54CV two schottky barrier double diodes quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. 13.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 14. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors BAT54CV two schottky barrier double diodes ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 15 november 2010 document identifier: BAT54CV please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 15. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 test information . . . . . . . . . . . . . . . . . . . . . . . . . 5 8.1 quality information . . . . . . . . . . . . . . . . . . . . . . 5 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 10 packing information . . . . . . . . . . . . . . . . . . . . . 6 11 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 12 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 legal information. . . . . . . . . . . . . . . . . . . . . . . . 8 13.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8 13.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 13.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 13.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 14 contact information. . . . . . . . . . . . . . . . . . . . . . 9 15 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
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